FEA simulation is an integrated design part in semiconductor industry, from miniature IC package to process equipment. The equipment design is fundamentally structural design with some additional consideration, e.g., vibration and fatigue. The electronic package design has its unique properties that require special considerations. For example, the IC package contains different types of materials and experience temperature cycles during its working life. Therefore, the CTE (coefficient thermal expansion) mismatch is very critical parameter in the design. In addition, the solder joints are the weak point in the board-level reliability, as it might accumulate creep strain during thermal cycles and finally cracks. Furthmore, the semiconductor process, such as wire bonding, introduce dynamic and transient loads to the package.

The electronic devices might also have to pass drop test before going to market. Though testing is still the best method to validate the design, FEA simulation plays more and more important role in the design phase to save the testing cost. FEA is able to locate the weakest point and find the possible solution to improve the design. Using the explicit algorithm, FEA is able to perform simulation for transient load and drop test. These simulation will greatly improve the design and save your cost.

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